UICC Chip Packaging

• ETSI TS 102 671 (M2M UICC)
  • MFF1 (DFN8, 5×6×1.27 mm)
  • MFF2 (DFN8, 5×6×1.27 mm)
• China Mobile
  • C2x2 (DFN8L, 2×2×0.5 mm)
• ST
  • ST33G1M2 (WLCSP11, 2.549×2.745×0.65 mm)
  • ST33J2M0 (WLCSP12, 2.328×2.487×0.5 mm)
• Infineon
  • OC1120 (WLCSP25, 2.9×2.5×0.4 mm)

Notes

• The project was Made with KiCAD
• MFF1, MFF2 and CMCC C2x2 pinout definitions are compatible
• WARNING: If use WLCSP packaging, Please read ST TN1163 before use.
• WARNING: If use DFN packaging, Please read OnSemi AND8211/D before use.

References

• ST33GTPMISPI (ST33G series, WLCSP11 package is the same)
• MFF2 SIM Card Specs
• MFF2 to 4FFNano Adapter
• 恒宝 M2M 智能卡产品规格书 (Chinese)
• 中国移动 C2x2 eSIM 芯片技术概要 v1.1 (Chinese)

LICENSE

CERN-OHL-P-2.0